MEDTRONIC Receives Patent for Electronic Package and Medical Device Design

Strategic Insights -

MEDTRONIC, a leading healthcare technology company, has been assigned a patent for its design of an electronic package and implantable medical device. The patent, number US 12082354 B2, was originally filed on January 12, 2022. The innovative design of the electronic package and medical device is attributed to four inventors: David A. Ruben, Andrew J. Ries, Pankti N. Shah, and Jason D. Hamack. This new technology is expected to improve the functionality and reliability of medical devices.

Key Takeaways:

  • The patent covers various embodiments of an electronic package and implantable medical device, including a nonconductive substrate, a conductive layer, and an electronic device.
  • The electronic package features a hermetically sealed conductive layer over the opening of the substrate, ensuring the integrity and reliability of the device.
  • The conductor block is electrically connected to the conductive layer, providing a safe and efficient pathway for electrical signals.
  • The design also includes a nonconductive cover hermetically sealed to the substrate, protecting the electronic device from external elements.
  • This technology has the potential to improve the functionality and reliability of a wide range of medical devices.
  • The four inventors, David A. Ruben, Andrew J. Ries, Pankti N. Shah, and Jason D. Hamack, were instrumental in designing and developing this innovative technology.
  • The patent filing date is January 12, 2022, indicating the date when the application was submitted to the patent office.

Statistics:

  • The patent number assigned to MEDTRONIC is US 12082354 B2.
  • The patent was originally filed on January 12, 2022.
  • The patent covers various embodiments of an electronic package and implantable medical device.

Sources:

  • MEDTRONIC, INC., assignment of patent number US 12082354 B2, originally filed January 12, 2022.