Thermal Conduction Sheet Holder and Method of Manufacturing Heat Dissipating Device

Strategic Insights -

A thermal conduction sheet holder and a method of manufacturing a heat dissipating device have been disclosed in a patent filed by inventors Mika Kobune, Keita Suga, and Michiaki Yajima. The patent, titled "Thermal conduction sheet holder and method of manufacturing heat dissipating device," was filed on October 14, 2021, and published online on October 14, 2025. The patent aims to provide an efficient method of manufacturing a heat dissipating device using a thermal conduction sheet holder.

The thermal conduction sheet holder consists of an elongated carrier film, a plurality of release layers, and a plurality of thermal conduction sheets. The thermal conduction sheets have a shortest distance between adjacent sheets of 2 mm or more and are disposed at intervals in the longitudinal direction of the carrier film. The sheets are also peelable from the carrier film via the release layers. The method of manufacturing a heat dissipating device using this thermal conduction sheet holder involves providing the sheet holder, peeling the cover film from the holder, pressure bonding one of the thermal conduction sheets to a heat generator or heat dissipator, peeling the carrier film from the chosen thermal conduction sheet, and finally, pressure bonding the other heat generator or heat dissipator to the opposite side of the thermal conduction sheet.

Key Takeaways:

  • The thermal conduction sheet holder consists of an elongated carrier film, a plurality of release layers, and a plurality of thermal conduction sheets.
  • The thermal conduction sheets have a shortest distance between adjacent sheets of 2 mm or more and are disposed at intervals in the longitudinal direction of the carrier film.
  • The sheets are also peelable from the carrier film via the release layers.
  • The method of manufacturing a heat dissipating device using the thermal conduction sheet holder entails providing the sheet holder, peeling the cover film from the holder, pressure bonding one of the thermal conduction sheets to a heat generator or heat dissipator, peeling the carrier film from the chosen thermal conduction sheet, and finally, pressure bonding the other heat generator or heat dissipator to the opposite side of the thermal conduction sheet.
  • The patent aims to provide an efficient method of manufacturing a heat dissipating device using a thermal conduction sheet holder.
  • The thermal conduction sheet holder is designed for a wide range of applications, including high-volume manufacturing of heat dissipating devices.
  • The holder's design enables efficient peelability of the thermal conduction sheets from the carrier film via the release layers.
  • The sheet holder can accommodate a variety of thermal conduction sheet thicknesses, including an average thickness of 50 mm to 500 mm.

Statistics:

  • The thermal conduction sheet holder has a shortest distance between adjacent thermal conduction sheets of 2 mm or more.
  • The sheets are disposed at intervals in the longitudinal direction of the carrier film.
  • The carrier film and cover film are designed to be peelable from the thermal conduction sheets.
  • The thermal conduction sheets contain a thermal conduction filler and a resin.
  • The average thickness of the thermal conduction sheets is from 50 mm to 500 mm.

Sources:

  • Patent: Kobune, Mika. Thermal conduction sheet holder and method of manufacturing heat dissipating device. U.S. Patent Number 12441576, filed October 14, 2021, and published online on October 14, 2025.
  • Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12441576)&db=USPAT&type=ids