AMD and IBM Expand Technology Alliance to Drive Innovation in Microprocessors

Strategic Insights -

AMD and IBM have broadened the scope of their technology alliance, with a focus on early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies. The agreement will enable both companies to identify and investigate future technology challenges earlier, allowing solutions to be found and fundamental technology choices to be made sooner. The extended alliance will drive innovation in microprocessors, with a particular focus on technologies for the 32nm and 22nm technology generations.

Key Takeaways:

  • The expanded alliance now includes early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies through 2011.
  • The agreement marks the first time a member of a technology development alliance will work directly with IBM's Research Division on R&D, electronic materials, and basic feasibility studies three-to-five years before commercialization.
  • The extended duration of the alliance makes it one of the longest IBM currently has with any of its semiconductor alliance associates.
  • Early exploratory research is a critical component of microprocessor R&D, enabling both companies to identify and investigate future technology challenges earlier.
  • The alliance will drive innovation in microprocessors, with a particular focus on technologies for the 32nm and 22nm technology generations.
  • The research and development will take place in IBM's Watson Research Center in Yorktown Heights, N.Y., the newly announced Center for Semiconductor Research at Albany NanoTech, and at IBM's 300 millimeter state-of-the-art manufacturing facility in East Fishkill.
  • AMD and IBM will work closely to bring advanced technology to market faster and more economically, providing added benefit to their customers.

Statistics:

  • The agreement will focus on early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies through 2011.
  • The alliance will enable AMD to better align its process technologies with the needs of its products scheduled to be introduced late in this decade and beyond.
  • The research and development will take place in three locations: IBM's Watson Research Center in Yorktown Heights, N.Y., the newly announced Center for Semiconductor Research at Albany NanoTech, and at IBM's 300 millimeter state-of-the-art manufacturing facility in East Fishkill.

Sources:

  • AMD (NYSE: AMD) press release, November 1, 2005
  • IBM Systems & Technology Group press release (Bernie Meyerson, IBM Fellow)
  • AMD website (www.amd.com)