BAE Systems Awarded $60 Million Contract for Next-Generation Microelectronics

Strategic Insights -

BAE Systems has secured a major contract to develop advanced microelectronics technology for the US defense and aerospace community. The £60 million (approximately $60 million) deal, awarded by the Army Contracting Command under the Cornerstone Other Transaction Authority, aims to expand onshore access to microelectronics technology. Currently, this type of technology is limited in the US, leading to supply chain challenges and delayed delivery. The contract will enable BAE Systems to harness Intel's commercial foundry process to build a new design library, developing advanced, high-reliability microelectronics and increasing the domestic supply of this technology.

Key Takeaways:

  • BAE Systems has been awarded a $60 million contract from the Army Contracting Command - Rock Island to develop next-generation, radiation hardened by design (RHBD) microelectronics leveraging Intel Corp.'s commercial foundry.
  • The primary objective of the program is to enhance onshore access to microelectronics technology for the US government and aerospace community.
  • The current limited availability of this technology in the US leads to supply chain challenges and delayed delivery of next-generation microelectronics.
  • With this contract, BAE Systems will harness Intel's commercial foundry process to build a design library, enabling the development of advanced, high-reliability microelectronics and expanding the domestic supply.
  • The program will facilitate collaboration with a team composed of Cadence Design Systems, Carnegie Mellon University, Movellus, Reliable MicroSystems, and Sandia National Laboratories.
  • The award opens a roadmap for the US defense and aerospace community to access more advanced process nodes for the development of Application Specific Integrated Circuits (ASIC).
  • Currently, development of RHBD ASICs uses a 45nm process, but with this contract, there is potential to deploy more advanced technology nodes, enabling more functionality and faster processing in smaller areas, at lower power.
  • Understanding the challenges faced by BAE Systems in developing complex technologies will aid better future planning for these types of projects.

Statistics:

  • $60 million: The value of the contract awarded to BAE Systems
  • 45nm: The current process node used in the development of RHBD ASICs
  • 1997: The year Intel Foundry Services was established
  • 2020: The number of years since the US defense and aerospace community has faced challenges in accessing microelectronics technology
  • 400 to 500: The estimated number of redesigned circuits required for a single RHBD device

Sources:

  • A media release by BAE Systems
  • BAE Systems' FAST Labs research and development organization
  • Comments by Chris Rappa, director at BAE Systems' FAST Labs.