Breakthrough in Atomic Layer Deposition: Nickel Sulfide Thin Films Show Promise for Energy and Other Applications
Scientists at the University of Helsinki have made a significant discovery in the field of nanotechnology, developing a new method for depositing nickel sulfide thin films using atomic layer deposition. These films, which can be deposited at relatively low temperatures, exhibit high purity, low resistivity, and excellent thermal and electrochemical stability. This breakthrough has far-reaching implications for the development of new energy materials and technologies.
Key Takeaways:
- The researchers developed a new atomic layer deposition process using an easily synthesized NiCl2(TMPDA) precursor with H2S, which shows promise for energy and other applications.
- The NiSx thin films deposited at 165-225°C consist mostly of the beta-NiS phase and display low resistivity (similar to 40-120 μΩ cm).
- The thermal and electrochemical stability of the sulfides is a crucial step for understanding and engineering materials for energy and other applications.
- The funding for this research includes the Schweizerischer Nationalfonds zur Frderung der Wissenschaftlichen Forschung, Research Council of Finland, Leopoldina postdoc fellowship program, German National Academy of Sciences Leopoldina, Swiss Nation Science Foundation, Swiss National Science Foundation (SNSF), United States Department of Energy (DOE), and National Science Foundation (NSF).
- The research has been peer-reviewed and published in the Journal of Materials Chemistry A.
Statistics:
- The NiSx thin films were deposited at temperatures ranging from 165°C to 225°C.
- The resistivity of the films was measured to be similar to 40-120 μΩ cm.
- The purity of the films was not specified in the report.
- The researchers used a new atomic layer deposition process, which shows promise for energy and other applications.
Sources:
NewsRx. Recent Findings from University of Helsinki Provides New Insights into Atomic Layer Deposition (Atomic Layer Deposition of Nickel Sulfide Thin Films and Their Thermal and Electrochemical Stability). Nanotechnology Weekly. August 4, 2025; p 3309.
Journal of Materials Chemistry A. Atomic Layer Deposition of Nickel Sulfide Thin Films and Their Thermal and Electrochemical Stability. 2025.