Breakthrough in Dielectric Ceramic Materials: Patent Approval for Novel Compositions

Strategic Insights -

Researchers at Skyworks Solutions, Inc. have made a significant contribution to the field of electronic components with the approval of a new patent for dielectric ceramic materials. According to the patent, the material can be utilized in various electronic components, including dielectric resonators. The ceramic dielectric materials have unique compositions, including Ba12M'(28+2x/3)Ti(54-x-y)M"'xGeyO162, where M' and M'" are specific rare earth and metal elements. The methods of fabricating and synthesizing these materials are also disclosed in the patent. This innovation has the potential to improve the performance and efficiency of electronic devices.

Key Takeaways:

  • The patent, entitled "Dielectric Ceramic Materials and Associated Methods," was published on June 23 by the World Intellectual Property Organization under Publication No. WO/2011/075123.
  • The invention discloses ceramic dielectric materials with specific compositions, including Ba12M'(28+2x/3)Ti(54-x-y)M"'xGeyO162, which can be used as electronic components.
  • The patent describes two aspects of the present invention: methods of fabricating a dielectric component and methods of synthesizing the disclosed ceramic dielectric materials.
  • The researchers at Skyworks Solutions, Inc. have made a significant contribution to the field of electronic components with this innovation.
  • The application was filed on December 16, 2009, under Application No. PCT/US2009/068262.
  • The inventive material can have a formula Ba12M'(28+2x/3)Ti(54-x-y)M"'xGeyO162, where M' is at least one rare earth element and M'" is at least one metal.
  • The methods of fabricating the inventive material involve fabricating specimens of the material using different techniques.

Statistics:

  • The inventive material can have a formula Ba12M'(28+2x/3)Ti(54-x-y)M"'xGeyO162, where M' is at least one rare earth element and M'" is at least one metal.
  • The application was filed on December 16, 2009, under Application No. PCT/US2009/068262.
  • The publication date of the patent is June 23 under Publication No. WO/2011/075123.

Sources:

  • Publication No. WO/2011/075123, World Intellectual Property Organization
  • Application No. PCT/US2009/068262, World Intellectual Property Organization