Industry Leaders Convene at Tessera's US Technology Symposium

Strategic Insights -

Industry leaders from across the semiconductor supply chain will convene at Tessera's fourth annual US Technology Symposium on July 10th, 2006, the day before the opening of SEMICON West 2006. The symposium will provide a comprehensive view of the technologies and trends driving the future of electronics miniaturization and performance. Experts from top companies, including Motorola, Hewlett-Packard, Intel, Samsung, and Cadence, will share their insights on challenges and solutions for miniaturization, trends in notebook computers, MEMS devices, and other key topics.

Key Takeaways:

  • Vahid Goudarzi from Motorola will explore the challenges and solutions for miniaturization of fully integrated wireless systems at the symposium.
  • Walter Fry from Hewlett-Packard will discuss the trends, technologies, and challenges for notebook computers, highlighting the importance of miniaturization in this segment.
  • Dr. John Heck from Intel will present on MEMS devices, highlighting the past, present, and future of miniature silicon-based machines and their potential applications.
  • Joe Virginia from Samsung will discuss mobilizing LCD technology and its implications for the electronics industry.
  • Felicia James from Cadence will explore accelerating the application of EDA technologies for complex designs and the benefits of collaboration in this area.
  • Mark Christensen from Prismark Partners will discuss SoC and SiP technologies, key enablers for continuing miniaturization of portable products.
  • Dr. Giles Humpston from Tessera will explore wafer level technologies for optical devices in portable electronics.

Statistics:

  • The symposium will be held at The Argent Hotel in San Francisco, California, with over 50 industry experts in attendance.
  • The event will run from 1:00-5:30 p.m., followed by a reception from 5:30-7:00 p.m.
  • The registration fee is $60.00, with priority given to pre-registered attendees.
  • The symposium is sponsored by Tessera, EETimes, Chip Scale Review, and Semiconductor Manufacturing Magazine.

Sources:

  • Tessera Technologies, Inc. (press release, July 2006, no date specified)
  • EETimes (press release, July 2006, no date specified)
  • Chip Scale Review (press release, July 2006, no date specified)
  • Semiconductor Manufacturing Magazine (press release, July 2006, no date specified)
  • Nasdaq: TSRA (publicly traded stock symbol)