PADS Software Unveils PowerBGA 3.0 for Advanced Packaging Design Automation

Strategic Insights -

PADS Software, Inc. has introduced PowerBGA 3.0, a cutting-edge solution for automating the interconnect process between bare die and a printed circuit board (PCB). This latest version provides enhanced design tools, support for design reuse methodologies, and expanded constraint-driven design capabilities. As chips become faster and packages smaller, semiconductor manufacturers and OEMs are adopting flip chip interconnect technology, which PowerBGA 3.0 addresses with new functionality in the Component IQ, Library IQ, and Design Editor modules.

Key Takeaways:

  • PowerBGA 3.0 offers new flip chip design tools, support for design reuse methodologies with a new physical design reuse (PDR) module, and expanded constraint-driven design capabilities.
  • The PDR module eliminates the need for time-consuming recreation of design elements by allowing customers to reuse circuitry while maintaining the physical integrity of the layout.
  • PowerBGA 3.0 enhances Intelligent Attribute Definition and Control, Extended API Commands, and Keepouts and Cutouts, streamlining the design process and improving efficiency.
  • PADS Software, Inc. is a worldwide supplier of software that aids in the design, layout, verification, and manufacturing of printed interconnect systems, with a user base exceeding 45,000 in 45 countries.
  • PowerBGA 3.0 will be available in Q3 1999 with prices ranging from $25,000-40,000.

Statistics:

  • 45,000: The number of users in PADS' user base in 45 countries.
  • $25,000-$40,000: The price range for PowerBGA 3.0.
  • Q3 1999: The quarter when PowerBGA 3.0 will be available.
  • 45: The number of countries where PADS has a user base.

Sources:

  • Business Wire, June 7, 1999
  • PADS Software, Inc.