Patent Application for Apparatus and Method for Operating Electronic Components

Strategic Insights -

A patent application filed by Kai-Min Chang and Yu-Xian Zhuang aims to provide an apparatus and method for operating electronic components in a semiconductor manufacturing process. The inventors describe a system that alleviates drawbacks of the prior art by measuring and managing electrostatic charges on workpieces. The proposed system includes a transporting unit, an operating unit, and an electrostatic measuring device to ensure safe and reliable processing.

Key Takeaways:

  • The inventors propose an apparatus for operating electronic components, including a transporting unit, an operating unit, and an electrostatic measuring device to measure electrostatic charges on workpieces.
  • The apparatus aims to alleviate drawbacks of the prior art by implementing a predetermined operating process on workpieces only when the electrostatic charge is below a predetermined value.
  • The method for operating electronic components involves transporting a workpiece on the operating rail to an operating area, measuring an electrostatic charge of the workpiece, and implementing the predetermined operating process if the charge is below the predetermined value.
  • The apparatus can perform various predetermined operating processes, including adhesive bonding, thermal interface material attaching, and heatsink attaching.
  • The system also includes an electrostatic eliminator to eliminate electrostatic charges on workpieces in cases where the charge exceeds the predetermined value.
  • The method provides for several variations, including transporting multiple workpieces in a matrix arrangement and implementing various operating processes, such as thermal interface material attaching or adhesive bonding.
  • The proposed system ensures safe and reliable processing of electronic components by managing electrostatic charges and implementing predetermined operating processes.

Statistics:

  • The patent application was filed on February 21, 2025 (Source: U.S. Patent Application Number 20250309184).
  • The patent application was made available online on October 2, 2025 (Source: U.S. Patent Application Number 20250309184).
  • The apprent application has 19 claims, including claims for various predetermined operating processes, such as adhesive bonding, thermal interface material attaching, and heatsink attaching.

Sources:

  • U.S. Patent Application Number 20250309184, filed February 21, 2025 and posted October 2, 2025