Patent Application for Improved Cooling Efficiency in Semiconductor Manufacturing Apparatuses

Strategic Insights -

A patent application filed on May 21, 2013, by inventors Kou Ito, Kouji Teramoto, and Hiroyasu Momikura, proposes a flow path member that enhances the cooling efficiency of workpieces in semiconductor manufacturing apparatuses. The inventors, employed by KYOCERA Corporation, aim to address the issue of decreased processing accuracy due to heat expansion during the back grinding process.

According to the patent application, the flow path member is made of a ceramic sintered body with a flow path that allows a fluid to flow through it. A projection formed on the inner wall of the flow path causes a turbulent flow, reducing the fluid's flow rate and thereby improving the cooling efficiency of the workpiece.

The inventors also describe an adsorption device and a cooling device that utilize the flow path member. These devices can be used to improve the cooling efficiency of workpieces during the manufacturing process.

Key Takeaways:

  • The patent application proposes a flow path member that enhances the cooling efficiency of workpieces in semiconductor manufacturing apparatuses.
  • The flow path member is made of a ceramic sintered body with a flow path that allows a fluid to flow through it.
  • A projection formed on the inner wall of the flow path causes a turbulent flow, reducing the fluid's flow rate and improving the cooling efficiency of the workpiece.
  • The inventors also describe an adsorption device and a cooling device that utilize the flow path member.
  • The devices can be used to improve the cooling efficiency of workpieces during the manufacturing process.

Statistics:

  • The patent application was filed on May 21, 2013.
  • The patent was made available online on May 14, 2015.
  • The inventors employed by KYOCERA Corporation.

Sources:

  • Ito, Kou; Teramoto, Kouji; Momikura, Hiroyasu. Flow Path Member, and Adsorption Device and Cooling Device Using the Same. Filed May 21, 2013 and posted May 14, 2015. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5858&p=118&f=G&l=50&d=PG01&S1=20150507.PD.&OS=PD/20150507&RS=PD/20150507 Keywords for this news article include: Electronics, Semiconductor, KYOCERA Corporation.