Patent Application for Structural Member with Protective Film Revealed

Strategic Insights -

Scientists at a Japanese research institution have recently filed a patent application for a structural member with a protective film that exhibits improved particle proof. The inventors, Morio Hosokawa and Tatsuya Koga, aim to provide a robust and reliable protective film that can withstand exposure to plasma in semiconductor manufacturing processes. According to the patent application, the key to achieving this lies in controlling the surface roughness of the base material, which the inventors have found to be a crucial parameter for ensuring the protective film's integrity.

Key Takeaways:

  • The structural member according to the patent application consists of a base material and a protective film covering its surface, where the base material's surface roughness has an average length RSm of 70 mm or more.
  • The inventors have found that a surface roughness with an average length RSm of 70 mm or more enables the formation of a protective film with excellent particle proof, even when the surface roughness is greater than 0.1 mm.
  • The patent application also describes methods for forming the protective film, including aerosol deposition, which has been increasingly practiced in recent years.
  • The study focuses on the surface roughness of the base material as a critical factor in preventing the occurrence of particles and ensuring the protective film's density and lifespan.
  • The structural member according to the patent application can be formed of various materials, including aluminum oxide and yttrium oxide.

Statistics:

  • The patent application was filed on March 12, 2025.
  • The inventors have conducted experiments demonstrating the efficacy of the structural member with a protective film.
  • The surface roughness of the base material has been found to have a significant impact on the protective film's performance.
  • The average length RSm of 70 mm or more has been identified as a critical parameter for achieving a protective film with excellent particle proof.