Patent Reveals Breakthrough in Circuit Board Design

Strategic Insights -

A novel circuit board structure with an embedded ceramic substrate and its manufacturing process have been disclosed in a recent patent. The innovation aims to improve heat dissipation performance, reduce costs, and enhance manufacturing efficiency. The patent, filed by Tong Hsing Electronic Industries Ltd. on May 3, 2023, was published online on September 30, 2025, as U.S. Patent Number 12432852.

This groundbreaking development responds to the increasing demand for thinner, smaller, and more functional electronic products. The existing circuit boards often face challenges such as heat generation, high costs, and limited manufacturing yields. The inventors, Lai, Jhih-Wei, Liao, Yu-Hsien, Pan, Ming-Yen, Shih, Jian-Yu, and Wu, Shih-Han, propose a circuit board structure with an embedded ceramic substrate to address these issues.

Key Takeaways:

  • The circuit board structure includes a circuit substrate, a ceramic substrate, positioning parts, an adhesive layer, and a metal layer to improve heat dissipation performance and reduce costs.
  • The ceramic substrate is embedded in the circuit board using an adhesive layer to seal the through-hole portion, resulting in improved manufacturing efficiency.
  • The manufacturing process involves providing a circuit substrate, a ceramic substrate, and positioning parts, followed by disposing an adhesive layer, forming a metal layer, and patterning it to form a circuit layer.
  • The circuit board structure can be made with a glass fiber insulating base and a synthetic ceramic material for the ceramic base, such as zirconia toughened alumina (ZTA), aluminum nitride, aluminum oxide, or silicon nitride.
  • The positioning parts and ceramic base can be integrally formed, with the positioning parts arranged on a peripheral surface of the ceramic base facing the insulating base.
  • Each positioning part comprises a projection with a specific protrusion width, with a size of 50 mm or less to improve manufacturing efficiency.

Statistics:

  • The patent was filed on May 3, 2023, and published online on September 30, 2025.
  • The U.S. Patent Number 12432852 is assigned to Tong Hsing Electronic Industries Ltd.
  • The innovation aims to improve heat dissipation performance, reduce costs, and enhance manufacturing efficiency.
  • The circuit board structure with an embedded ceramic substrate can be made with glass fiber and synthetic ceramic materials.

Sources:

  • Lai, Jhih-Wei. Circuit board structure with embedded ceramic substrate and manufacturing process thereof. U.S. Patent Number 12432852, filed May 3, 2023, and published online on September 30, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12432852)&db=USPAT&type=ids