S3 Incorporated Expands Production Capacity with IBM-Burlington Partnership

S3 Incorporated, a leading manufacturer of graphics and video acceleration products, has announced a partnership with IBM-Burlington to increase production capacity for its sub-micron wafers. This new agreement marks the fifth high-volume manufacturer to partner with S3, joining other vendors in the US and Southeast Asia. The partnership is expected to enhance S3's ability to meet growing demand for its acceleration products.

Key Takeaways:

  • S3 Incorporated has partnered with IBM-Burlington to increase production capacity for sub-micron wafers, marking the fifth high-volume manufacturer to partner with the company.
  • The partnership will enable S3 to increase its acceleration product offerings and meet growing demand from OEM customers.
  • Terry Holdt, President and CEO of S3, stated that IBM-Burlington's world-class technology for semiconductor fabrication has been a welcome addition to S3's manufacturing capabilities.
  • S3 and IBM have worked extensively over the last three months to reach high-volume wafer production.
  • The partnership is part of S3's commitment to increasing capacity and applying acceleration technology to create a natural PC interface.

Statistics:

  • Five high-volume manufacturers are now partnered with S3 Incorporated, marking a significant increase in production capacity.
  • The partnership with IBM-Burlington is expected to enhance S3's ability to meet growing demand for acceleration products.
  • S3 has worked extensively with IBM over the past three months to reach high-volume wafer production.
  • S3 Incorporated is a publicly held company with a focus on applying acceleration technology to create a natural PC interface.

Sources:

  • BUSINESS WIRE
  • S3 Incorporated (NASDAQ:SIII) press release
  • Terry Holdt, President and CEO of S3 Incorporated