Samsung Electronics Co. Ltd. Files Patent Application for Panel-Level Glass Based Embedded Silicon Bridge Package And Method of Manufacturing

Strategic Insights -

Samsung Electronics Co. Ltd., a leading South Korean conglomerate, has filed a patent application for a groundbreaking panel-level glass based embedded silicon bridge package and its manufacturing method. As the electronics industry continues to shrink devices and increase power consumption, this innovation seeks to address the growing need for high-reliability, high-performance, and high-capacity semiconductor packages.

Key Takeaways:

  • The patent application, filed on June 28, 2024, and posted on October 16, 2025, describes a semiconductor package with a glass interposer and a bridge chip that connects two semiconductor chips.
  • The proposed method involves providing a first redistribution layer, a glass substrate, and a second redistribution layer, followed by the insertion of a bridge chip to connect the two semiconductor chips.
  • The semiconductor package includes a first semiconductor chip, a second semiconductor chip, and a bridge chip, which is integrated into the glass substrate to ensure reliable electrical connections.
  • The patent application provides detailed drawings and descriptions of the semiconductor package and its manufacturing process, highlighting the importance of the bridge chip in connecting the two semiconductor chips.
  • The claims of the patent application outline the specific features and functionalities of the semiconductor package, including the use of a through-glass via to connect the first redistribution layer and the second redistribution layer.
  • The patent application highlights the need for high-performance and high-capacity semiconductor packages, as well as the importance of addressing power consumption and reliability concerns in the electronics industry.

Statistics:

  • The patent application comprises 20 claims, including 15 claims related to the semiconductor package and 5 claims related to the manufacturing method.
  • The patent application describes a semiconductor package with a glass interposer and a bridge chip, which is an innovative approach to addressing power consumption and reliability concerns.
  • The use of a bridge chip can improve the reliability and performance of the semiconductor package, enabling it to serve as a key component in the development of smaller and more powerful electronic devices.
  • The patent application is assigned to Samsung Electronics Co. Ltd. (Suwon-si, South Korea).

Sources:

  • KIM, WooPoung, and YANG, Jin. Panel-Level Glass Based Embedded Silicon Bridge Package And Method Of Manufacturing The Same. U.S. Patent Application Number 20250323134, filed June 28, 2024, and posted October 16, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(20250323134)&db=US-PGPUB&type=ids