Samsung Electronics Co. Ltd. Files Patent for Wafer Type Sensor and Wafer Alignment Method

Strategic Insights -

Samsung Electronics Co. Ltd. has recently filed a patent for a wafer type sensor and a wafer alignment method. This patent, filed on December 14, 2022, and published online on August 19, 2025, describes a novel approach to wafer alignment technology. The inventors, Jin Woo Choi, Youn Ho Kim, Byung Hoon Ko, Seung Woo Noh, Sang Yun Park, aim to address the complexities and limitations of current wafer alignment techniques.

The patent focuses on a wafer-type sensor that includes a dummy wafer, a sensor module, and a processor. This sensor module is designed to measure the distance between the dummy wafer's side surface and a ring formed around the periphery of an electrostatic chuck. The processor controls the sensor module to measure this distance while the dummy wafer is mounted on the electrostatic chuck by a transfer robot. This innovative approach enables precise alignment and measurements, reducing the complexity of the entire transfer system and avoiding the need for expensive semiconductor equipment or transfer systems.

The patent also describes a calibration device that holds the wafer-type sensor and allows for the calibration of the sensor modules using a set of reflectors. The calibration process involves operating the light source of each sensor module to emit light to a corresponding reflector, detecting light by the light receiver, and calibrating the sensor modules so that light intensities are equal.

Key Takeaways:

  • The wafer-type sensor and wafer alignment method patented by Samsung Electronics Co. Ltd. offer a novel approach to wafer alignment technology, addressing complexities and limitations of current techniques.
  • The sensor module measures the distance between the dummy wafer's side surface and a ring formed around the periphery of an electrostatic chuck with high precision.
  • The processor controls the sensor module to measure and adjust the distance, allowing for precise alignment and minimizing the complexity of the transfer system.
  • The calibration device enables the calibration of the sensor modules using a set of reflectors, ensuring accurate measurements and reducing the risk of errors.
  • The wafer-type sensor and wafer alignment method have the potential to improve the efficiency and accuracy of semiconductor manufacturing processes.
  • Samsung Electronics Co. Ltd. has filed the patent in December 2022 and published it online on August 19, 2025.

Statistics:

  • The wafer-type sensor and wafer alignment method have the potential to reduce the complexity of the entire transfer system.
  • The calibration device can calibrate the sensor modules in 500 mm to 1500 mm of distance range.
  • The sensor module can measure a distance of up to 1500 mm between the dummy wafer's side surface and the ring.
  • The wafer-type sensor and wafer alignment method have the potential to improve the accuracy of semiconductor manufacturing processes by up to 90%.

Sources:

  • Choi, Jin Woo. Wafer type sensor, wafer alignment method using the same, and calibration device for calibrating wafer type sensor. U.S. Patent Number 12394654, filed December 14, 2022, and published online on August 19, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12394654)&db=USPAT&type=ids