Samsung Electronics Co. Ltd. Receives Patent for Equipment Front End Module and Destructive Analysis Automation Apparatus

Strategic Insights -

Samsung Electronics Co. Ltd. has been granted a patent for an Equipment Front End Module (EFEM) and a destructive analysis automation apparatus, according to a patent published by the United States Patent and Trademark Office (USPTO). The patent, filed on April 1, 2022, and published online on July 1, 2025, under U.S. Patent Number 12343881, showcases Samsung's innovative approach to improving efficiency and productivity in the semiconductor industry.

The invention describes an EFEM that includes a base, a tray port, a working robot, and a shuttle port, which work together to automate the transportation process of a sample aid between analysis apparatuses and a storage process of the sample aid. The EFEM is designed to improve the efficiency and productivity of the semiconductor industry by reducing the need for manual labor and minimizing the risk of damage to the region of interest.

The patent also describes a destructive analysis automation apparatus that includes a main device configured to perform a semiconductor destructive analysis and an EFEM connected to the side of the main device. The EFEM comprises a tray port, a shuttle port, and a working robot, which perform various operations to automate the destructive analysis process.

Key Takeaways:

  • The patent, U.S. Patent Number 12343881, was filed on April 1, 2022, and published online on July 1, 2025.
  • The invention describes an Equipment Front End Module (EFEM) that automates the transportation process of a sample aid between analysis apparatuses and a storage process.
  • The EFEM includes a base, a tray port, a working robot, and a shuttle port, which work together to improve efficiency and productivity.
  • The patent also describes a destructive analysis automation apparatus that includes a main device configured to perform a semiconductor destructive analysis and an EFEM connected to the side of the main device.
  • The invention aims to reduce the need for manual labor and minimize the risk of damage to the region of interest.
  • Samsung Electronics Co. Ltd. is the assignee of this patent.
  • The patent covers various aspects of the destructive analysis automation apparatus, including the EFEM, the main device, and the tray transfer device.
  • The invention is designed to improve the efficiency and productivity of the semiconductor industry.

Statistics:

  • U.S. Patent Number 12343881 was filed on April 1, 2022.
  • The patent was published online on July 1, 2025.
  • The EFEM includes a tray port, a shuttle port, a working robot, and a base that communicate with a processor.
  • The destructive analysis automation apparatus includes a main device, an EFEM, and a tray transfer device.
  • The EFEM is designed to improve efficiency and productivity by reducing manual labor and minimizing damage to the region of interest.

Sources:

  • Gu, Gil Ho. Equipment front end module and destructive analysis automation apparatus including the same. U.S. Patent Number 12343881, filed April 1, 2022, and published online on July 1, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12343881)&db=USPAT&type=ids