Samsung Forms Alliance with IBM to Develop Non-Memory Chips
Samsung Electronics Co., the world's largest maker of computer memory chips, has formed a strategic alliance with International Business Machines Corp. (IBM) and two other partners to develop non-memory chips. This tie-up marks Samsung's first notable step towards becoming a significant player in the lucrative non-memory chip sector, in which it has little presence. The agreement, reached between Samsung's Hwang Chang-kyu and IBM's John Kelly, will see the companies jointly develop non-memory chips using advanced technology, including 65 nanometer and 45 nanometer wires. Samsung plans to increase its spending on non-memory chips to 1.24 trillion won this year, and estimates that the alliance will generate $5 billion in new sales in 2007.
Key Takeaways:
- Samsung Electronics has formed a strategic alliance with IBM, Chartered Semiconductor Manufacturing Ltd., and Infineon Technologies AG to develop non-memory chips.
- The tie-up marks Samsung's first notable step towards becoming a significant player in the non-memory chip sector, where it has little presence.
- The companies will jointly develop non-memory chips using advanced technology, including 65 nanometer and 45 nanometer wires.
- IBM will provide technology for Samsung to produce non-memory chips with 90-nanometer wires on 300-millimeter silicon wafers.
- Samsung plans to increase its spending on non-memory chips to 1.24 trillion won this year (approximately $1.06 billion).
- The alliance is expected to generate $5 billion in new sales for Samsung in 2007.
- Samsung's partnership with IBM is seen as a response to the company's competitor, Intel Corp., in the non-memory chip sector.
Statistics:
- Samsung plans to increase its spending on non-memory chips to 1.24 trillion won this year (approximately $1.06 billion).
- The alliance will generate $5 billion in new sales for Samsung in 2007.
Sources:
- Yonhap (no date provided)
- "Samsung Forms Alliance with IBM to Develop Non-Memory Chips"
(Asia Pulse, March 8, 2005)