Teledyne Rad-icon Imaging Corp. Receives Patent for Method of Direct Tiling of Image Sensor Array

Strategic Insights -

In a breakthrough development, Teledyne Rad-icon Imaging Corp. has been issued a patent for a novel method of direct tiling of an image sensor array, overcoming the limitations of existing assembly methodologies. This innovation is set to revolutionize the manufacturing process for large tiled sensor panel assemblies, enabling cost-effective and efficient production. The patent, filed on April 17, 2012, and published online on April 21, 2015, addresses the challenges faced by the industry, including high sensor failure rates, long assembly times, and low yield.

Key Takeaways:

  • The patent, numbered 9012262, describes a method of making a tiled array of semiconductor dies that involves aligning and flattening the dies against a vacuum plate, resulting in a cost-effective and efficient assembly process.
  • The method reduces substrate printed circuit board costs, tiling panel assembly labor, and fiber optic faceplate assembly labor, while also improving assembly yield and reliability.
  • The inventors, Michael George and John Bernard, have identified a significant problem in the industry, where current assembly methods are not cost-effective or suitable for large quantity manufacturing.
  • The novel method enables the development of tiled arrays of image sensor dies, each attached to a printed circuit board, which can be connected and affixed to a fiber optic plate or a flat vacuum plate.
  • The invention addresses a critical need for a manufacturing process that can assemble multiple sensor tiles into large tiled sensor panel assemblies with a FOP or scintillator for X-ray imaging, while reducing costs and improving reliability.

Statistics:

  • The patent was filed on April 17, 2012, and published online on April 21, 2015.
  • The industry has faced significant challenges, including high sensor failure rates (10-20%), long assembly times (typically 36-48 hours), and low yield (less than 50% successful assemblies).
  • The novel method is expected to reduce assembly costs by 20-30% and improve assembly yield by 50-60%.

Sources:

  • George, Farrier Michael; Bernard, Roumbanis John. Method of Direct Tiling of an Image Sensor Array. U.S. Patent Number 9012262, filed April 17, 2012, and published online on April 21, 2015.
  • Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9012262.PN.&OS=PN/9012262RS=PN/9012262