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International Business Machines Corp.

ClassOne Technology and IBM Research Collaborate on Advanced Wet Processing for Semiconductor Manufacturing

Strategic Insights

— 1 min read

ClassOne Technology, a global leader in electroplating and wet processing tools, and IBM Research have joined forces to develop innovative solvent solutions for advanced semiconductor and packaging process applications. The joint development agreement leverages both companies' expertise in semiconductor chemistry to create best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices. This collaboration marks a significant step forward in developing alternatives for advanced semiconductor processing, with a focus on creating novel solutions that can be shared throughout the industry.

Key Takeaways:

  • ClassOne Technology and IBM Research have signed a joint development agreement to develop innovative solvent solutions for advanced semiconductor and packaging process applications.
  • The collaboration will leverage ClassOne's flexible wafer-processing platform and seasoned team, combined with IBM's extensive research experience and resources, to create best known methods (BKMs) for non-NMP solvent processing.
  • The focus of the joint project is to develop BKMs for non-NMP solvent processing in manufacturing IBM semiconductor devices.
  • ClassOne has been a strategic supplier to IBM since 2014, developing technologies in electroplating, metal lift-off (MLO), and wet cleaning processes.
  • The collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing.
  • The two companies will work together to create novel solutions that can be shared throughout the industry.
  • ClassOne CEO Byron Exarcos noted that this collaboration will result in "significant step forward" in developing alternatives for advanced semiconductor processing.

Statistics:

  • ClassOne Technology has been a strategic supplier to IBM since 2014.
  • The joint development agreement between ClassOne Technology and IBM Research is focused on developing best known methods (BKMs) for non-NMP solvent processing.
  • NMP (N-Methylpyrrolidone) is a chemical compound used in a variety of industries, including semiconductor fabrication, and is the focus of the joint project.
  • NMP has been a widely used chemical compound in semiconductor fabrication for removal of surface materials.

Sources:

  • "ClassOne Technology and IBM Research Collaborate on Advanced Wet Processing for Semiconductor Manufacturing." Close-Up Media.
  • ClassOne.com.

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