Electromagnetic Shielding for Electronic Chips: Novel Patent Application

Researchers have been exploring innovative methods to combat electromagnetic interference (EMI) in electronic chips, which can hinder their performance and reliability. Recently, a patent application was filed by Pietro Natale Alessandro Chyurlia, detailing a novel electromagnetic shielding concept for electronic chips. This technology involves integrating a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the chip and a second region away from the chip. According to the patent application, the shielded assembly can include a substrate, a flip chip die, a carrier wafer layer, and a conductive layer. The shielding component can also include shielding wirebonds to provide electrical connection between the conductive layer and a ground plane of the substrate.

Key Takeaways:

• The patent application, filed by Pietro Natale Alessandro Chyurlia on April 28, 2025, proposes a novel electromagnetic shielding concept for electronic chips.
• The shielded assembly includes a substrate, a flip chip die, a carrier wafer layer, and a conductive layer, with the conductive layer providing electromagnetic shielding.
• Shielding wirebonds are used to provide electrical connection between the conductive layer and a ground plane of the substrate.
• The shielding component can be implemented in various embodiments, including a phone board, a packaging substrate, and a module.
• The patent application also covers additional features, such as an absorber layer and harmonic trap circuits, to enhance the shielding performance.

Statistics:

• The patent application has been filed with the U.S. Patent and Trademark Office (USPTO) under the number 20250323176.
• The application was made available online on October 16, 2025.
• The claims supplied by the inventor include a wireless device with a shielded assembly, a die mounted to a substrate, a carrier wafer layer disposed over the back side of the die, and a conductive layer disposed over the carrier wafer layer.

Sources:

• CHYURLIA, Pietro Natale Alessandro. Shielded Radio-Frequency Devices Configured To Provide Shielding For Electromagnetic Interference (Emi). U.S. Patent Application Number 20250323176, filed April 28, 2025 and posted October 16, 2025. Patent URL: https://ppubs.uspto.gov/pubwebapp/external.html?q=(20250323176)&db=US-PGPUB&type=ids