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Electronic components

Innovative Sensor Assembly for Vehicles Patented by BRP Megatech Industries Inc.

Strategic Insights

— 1 min read

A recent patent filing has disclosed an innovative sensor assembly designed for vehicles, which has been published by the United States Patent and Trademark Office on October 14, 2025. The invention, titled "Structural locating sensors for a sensor module using a printed circuit board assembly," is attributed to inventors Francis Gagne and Jonathan Nobert, and is assigned to BRP Megatech Industries Inc. This patent outlines a novel sensor assembly that utilizes a plurality of auxiliary printed circuit boards (PCBs) coupled to a main PCB, allowing for the detection of changes in applied torque via measured magnetic fields.

Key Takeaways:

  • The patent describes a sensor assembly for a vehicle that includes a sensor module with multiple auxiliary printed circuit boards (PCBs) and a main PCB.
  • The sensor assembly measures applied torque by detecting changes in magnetic fields generated by magnetoelastic regions on the PCBs.
  • The invention includes a retainer that maintains the defined position of each auxiliary PCB relative to each other, as well as attachment elements that electrically connect the auxiliary PCBs to the main PCB.
  • The sensor assembly also includes a controller that determines the magnitude of movement based on signals from the sensors.
  • The plurality of attachment elements are configured to electrically connect a plurality of terminals of the auxiliary PCBs to a plurality of terminals of the main PCB.
  • The retainer includes a plurality of retention members that directly engage the plurality of auxiliary PCBs, and at least four retention members are included.
  • The sensor assembly includes a component positioned adjacent the sensor module and moveable relative to the sensor module, with an emitter configured to generate a signal based on movement of the component and the emitter.

Statistics:

  • The patent was filed on March 4, 2020.
  • The patent was published online on October 14, 2025.
  • The sensor assembly includes multiple auxiliary printed circuit boards (PCBs) that are coupled to a main PCB.
  • The retainer includes a plurality of retention members that engage the auxiliary PCBs.
  • The sensor assembly measures applied torque by detecting changes in magnetic fields generated by magnetoelastic regions on the PCBs.

Sources:

  • Gagne, Francis. Structural locating sensors for a sensor module using a printed circuit board assembly. U.S. Patent Number 12442701, filed March 4, 2020, and published online on October 14, 2025. Patent URL: https://ppubs.uspto.gov/pubwebapp/external.html?q=(12442701)&db=USPAT&type=ids.

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