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Electronic components

Murata Manufacturing Co. Ltd. Receives Patent for Enhanced Electronic Component Design

Strategic Insights

— 1 min read

A newly invented electronic component has been patented by Murata Manufacturing Co. Ltd., a prominent Japanese electronics company. The patented design aims to balance the need for ensured adhesiveness of electrodes with the prevention of short-circuiting between adjacent electrodes, a common challenge in electronic component manufacturing.

Key Takeaways:

  • The patented electronic component features a unique design with a first electrode composed of a first material and a second electrode composed of the same material, except for a specific portion with a higher affinity for solder.
  • The first electrode has a first portion with a first thickness and a second portion with a second thickness smaller than the first thickness in at least a part of the peripheral portion.
  • The first portion is covered with a plated film, exposing a film made of a second material with higher affinity for solder at the outermost surface.
  • The second portion is covered with a resist film to isolate the first electrode from the second electrode.
  • The design allows for reduced profile while ensuring adhesiveness of electrodes and suppressing short-circuiting between adjacent electrodes.
  • Claims for the patent include specific details on materials, film structures, and arrangements.

Statistics:

  • The patent was filed on October 2, 2023.
  • The patent was published online on October 14, 2025.
  • The patent number is 12446152.
  • The inventor of the patent is Takahiro Kitazume.

Sources:

  • Kitazume, Takahiro. Electronic component. U.S. Patent Number 12446152, filed October 2, 2023, and published online on October 14, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12446152)&db=USPAT&type=ids
  • Business, Electronics, Circuit Board, Semiconductor, Murata Manufacturing Co. Ltd.

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