Samsung Display Co. Ltd. Receives Patent for Thin Film Deposition Apparatus
Developed by a team of inventors led by Choi, Yong-Sup, a thin film deposition apparatus that can be easily manufactured, applied on a mass scale, and improves manufacturing yield and deposition efficiency has been patented by Samsung Display Co. Ltd. The patent, number 12442069, was filed on March 28, 2019, and published online on October 14, 2025. This innovative apparatus aims to address the limitations of traditional thin film deposition methods, particularly in the formation of fine patterns in organic thin films.
Key Takeaways:
- The patent provides a thin film deposition apparatus that may be easily manufactured, applied on a mass scale, and improves manufacturing yield and deposition efficiency.
- The apparatus includes a deposition source, a deposition source nozzle unit, and a patterning slit sheet, which are formed integrally with each other.
- The claims of the patent describe a thin film deposition apparatus for forming a thin film on a substrate, comprising a deposition source, a deposition source nozzle unit, a patterning slit sheet, a frame, and a connection member that connects the deposition source, the deposition source nozzle unit, and the frame.
- The connection member allows for deposition material to be guided and seals a space between the deposition source and the deposition source nozzle unit, and the patterning slit sheet from external air.
- The patterning slit sheet includes a plurality of patterning slits arranged in a row in a second direction that is perpendicular to the first direction, and each of the patterning slits is elongated in the first direction so as to overlap the plurality of deposition source nozzles.
- The apparatus improves the manufacturing yield and deposition efficiency by reducing the complexity of the deposition process and allowing for the formation of fine patterns in organic thin films.
Statistics:
- Patent number: 12442069
- Filed date: March 28, 2019
- Published date: October 14, 2025
- Claim 1: A thin film deposition apparatus for forming a thin film on a substrate, the apparatus comprising: a deposition source, a deposition source nozzle unit, a patterning slit sheet, a frame, and a connection member that connects the deposition source, the deposition source nozzle unit, and the frame.
- Claim 2: The thin film deposition apparatus of claim 1, wherein the connection member directly contacts the deposition source nozzle unit.
Sources:
- Choi, Yong-Sup. Thin film deposition apparatus. U.S. Patent Number 12442069, filed March 28, 2019, and published online on October 14, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12442069)&db=USPAT&type=ids