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Control equipment

Data Collection Method for Semiconductor Processing Equipment Patented

Strategic Insights

— 1 min read

A team of inventors led by Chai, Jiajia has developed a novel data collection method for semiconductor processing equipment, which has been patented as U.S. Patent Number 12430354. The patent was filed on August 24, 2022, and published online on September 30, 2025. The invention aims to improve data collection capabilities in semiconductor manufacturing, enabling factories to collect specific data from equipment, analyze it to enhance productivity, and reduce costs.

According to the patent, the existing technology has limitations, such as a low data collection capability of processing 2000 pieces of data per second. The inventors' solution involves a data collection method, device, and system for semiconductor processing equipment that overcomes these problems. The method includes receiving an activated data collection plan, determining equipment data information to be collected, sending the data information to the semiconductor processing equipment, and receiving equipment data corresponding to the data information.

Key Takeaways:

  • The patented data collection method is designed to improve data collection capabilities in semiconductor manufacturing.
  • The method involves receiving an activated data collection plan, determining equipment data information, sending the data information to the semiconductor processing equipment, and receiving equipment data.
  • The existing technology limits the data collection capability to processing 2000 pieces of data per second.
  • The inventors' solution includes a data collection method, device, and system for semiconductor processing equipment.
  • The equipment control system in the method includes a data structure converter based on an Interface A standard.
  • The method allows for data format conversion on the equipment data by the data structure converter and displaying the equipment data after the data format conversion.

Statistics:

  • The existing technology has a data collection capability of processing 2000 pieces of data per second.
  • The patented data collection method is applied to an equipment data collection server.
  • The method involves communicatively connecting the server to the equipment control system via a first communication interface and to the semiconductor processing equipment via a second communication interface.
  • The method includes sending a control instruction for the semiconductor processing equipment via a third communication interface.

Sources:

  • Chai, Jiajia. Data collection method, device, and system of semiconductor processing equipment. U.S. Patent Number 12430354, filed August 24, 2022, and published online on September 30, 2025.
  • https://ppubs.uspto.gov/pubwebapp/external.html?q=(12430354)&db=USPAT&type=ids

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