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Air pollution

Effective Solution for NOx Emissions in Semiconductor Manufacturing

Strategic Insights

— 1 min read

New research from the Institute for Environmental Engineering has provided a crucial breakthrough in addressing a significant pollution issue in the semiconductor manufacturing process. The study focused on the emission of nitrous oxide (NOx) in burn-wet and plasma-wet local scrubbers (LSCs), which is a major environmental concern in the industry. The research team developed an ozone pre-oxidation unit that effectively oxidizes NO to NO2 with a conversion efficiency of nearly 100%. The subsequent wet scrubbing process removed NO2 with removal efficiencies exceeding 80%, making it a highly efficient and viable solution for NOx control.

Key Takeaways:

  • The emission of NOx in semiconductor manufacturing is a significant pollution issue, particularly in burn-wet and plasma-wet LSCs.
  • Pre-oxidation combined with wet scrubbing offers a practical and effective solution for controlling NOx emissions from these LSCs.
  • The developed ozone pre-oxidation unit effectively oxidized NO to NO2 with a conversion efficiency of nearly 100%.
  • The subsequent wet scrubbing process removed NO2 with removal efficiencies exceeding 80%.
  • Long-term field tests showed that the NOx removal efficiency approached 100% during continuous operation for 24 hours.
  • The research highlights the practical applicability of the O-3 pre-oxidation unit for exhaust gas treatment in semiconductor manufacturing.
  • The study has been peer-reviewed and published in Process Safety and Environmental Protection.

Statistics:

  • NOx emission in semiconductor manufacturing is a significant pollution issue.
  • Pre-oxidation combined with wet scrubbing offers a 100% conversion efficiency of NO to NO2.
  • Wet scrubbing process removed NO2 with removal efficiencies exceeding 80%.
  • Long-term field tests showed a 100% NOx removal efficiency during continuous operation for 24 hours.
  • The ozone pre-oxidation unit ensures compliance with safety and environmental standards in semiconductor manufacturing.

Sources:

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Control of Nox Emission Using Ozone Oxidation Combined With Wet Scrubbing Method In Semiconductor Manufacturing. Process Safety and Environmental Protection, 2025;201.

(Elsevier, www.elsevier.com; Process Safety and Environmental Protection, www.journals.elsevier.com/process-safety-and-environmental-protection/)

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