Electrically Conductive Bonds for Solar Cells: BASF Develops Innovative Process

Researchers at BASF have developed an innovative process for producing electrically conductive bonds between solar cells, as patented in the World Intellectual Property Organization (WIPO) publication WO/2011/101788. The process involves transferring an adhesive with electrically conductive particles to a substrate using a laser, followed by partial drying and curing, bonding to an electrical connection, and final curing. This method results in a durable and efficient electrically conductive bond for solar cells.

Key Takeaways:

• The patented process involves transferring an adhesive with electrically conductive particles to a substrate using a laser, resulting in a durable and efficient electrically conductive bond.
• The adhesive used in the process consists of 20-98% by weight of electrically conductive particles, 0.01-60% by weight of an organic binder component, and 0.005-20% by weight of absorbent.
• The process also involves the use of 0-50% by weight of a dispersant and 1-20% by weight of solvent in the adhesive.
• The invented process can be used for a variety of applications, including solar cells, where electrically conductive connections are required.
• The use of a laser for transferring the adhesive provides high precision and accuracy, enabling the creation of complex patterns and designs.
• The patented process has the potential to improve the efficiency and lifespan of solar cells.

Statistics:

• The process involves the use of 20-98% by weight of electrically conductive particles in the adhesive.
• The organic binder component used in the adhesive accounts for 0.01-60% by weight, based on the solids content.
• The absorbent used in the adhesive accounts for 0.005-20% by weight, based on the weight of the conductive particles.
• Up to 50% by weight of a dispersant and 1-20% by weight of solvent can be used in the adhesive.
• The process has the potential to improve the efficiency of solar cells by optimizing electrically conductive connections.

Sources:

• WIPO publication WO/2011/101788
• Application No. PCT/IB2011/050641