Heat Conducting Mounting Structure for Electronic Modules Patented by Ericsson

A recent patent titled "Heat Conducting Mounting Structure, Method and Radio Base Station Housing Arrangement for Mounting Electronic Modules" has been published by the World Intellectual Property Organization. The invention, filed by Telefonaktiebolaget L M Ericsson (PUBL) on December 23, 2009, describes a heat conducting mounting structure for mounting electronic modules. The structure features a first surface area for facing a second surface area of the electronic module, cavity means for receiving a cooling means, and attachment means for attaching the electronic module while transferring heat energy.

Key Takeaways:

• The patent describes a heat conducting mounting structure designed for electronic modules, comprising a first surface area, cavity means, and attachment means for attaching the module and transferring heat energy.
• The structure is designed to facilitate the transfer of heat energy from the electronic module to the mounting structure, thereby improving cooling efficiency.
• The patent also describes a method for mounting the electronic module on the heat conducting mounting structure, involving the use of an attachment means with a fixing means.
• The invention has implications for the design of radio base stations, as it provides a heat conducting mounting structure for mounting electronic modules.
• The patent was filed under Application No. PCT/SE2009/051495 on December 23, 2009.
• The invention is attributed to Ulf Ekstedt and Mikael Johansson, two inventors listed in the patent.

Statistics:

• Application No. PCT/SE2009/051495 was filed on December 23, 2009.
• The patent was published on June 30 (no year mentioned).
• The invention is described in the World Intellectual Property Organization publication No. WO/2011/078754.

Sources:

• World Intellectual Property Organization, Publication No. WO/2011/078754
• http://www.wipo.int