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Hermetic Packaging of Integrated Circuit Components: A Breakthrough for RF and MEMS Devices

Strategic Insights

— 1 min read

Research and development in hermetic packaging of integrated circuit components has led to significant breakthroughs in the field of radio frequency (RF) and microelectromechanical systems (MEMS) devices. Engineers at Raytheon Company have invented a method for forming hermetic packages using silicon wafers, which can be transformed to create conductive regions and capacitive characteristics. This innovative approach allows for the fabrication of hermetic vias and the integration of interconnect functions in hermetically sealed integrated circuit packages.

Key Takeaways:

  • The inventors have developed a method for forming hermetic packages using silicon wafers, which can be transformed to create conductive regions and capacitive characteristics.
  • Hermetic packaging of wafers containing ICs as a single unit and subsequent separation of the hermetically packaged chips at the completion of the process can significantly reduce the handling of individual chips and labor for bonding I/O's.
  • The fabrication of hermetic vias can be integrated into a standard silicon fab, and completed unpackaged individual chips can be bonded to silicon carrier wafers.
  • Technical advantages of the invention include hermetic packaging of wafers, reduction of labor for packaging and I/O bonding, and integration of interconnect functions in hermetically sealed integrated circuit packages.
  • The invention has potential applications in RF and MEMS devices, optoelectronics, RF module technology, and three-dimensional stacking.
  • The use of reactive elements to replace contacts becomes more practical as technology pushes for the development of Microwave Monolithic Integrated Circuits (MMICs) operating at higher frequencies.

Statistics:

  • The patent was filed on June 23, 2014, and published online on September 22, 2015.
  • Patent number: 9142429
  • Assignee: Raytheon Company
  • Keywords for this news article: Silicon, Technology, RAYTHEON COMPANY.

Sources:

  • Chahal, Premjeet; Morris, Francis J.. Hermetic Packaging of Integrated Circuit Components Having a Capacitor for Transfer of Electrical Signals. U.S. Patent Number 9142429, filed June 23, 2014, and published online on September 22, 2015. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9142429.PN.&OS=PN/9142429RS=PN/9142429

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