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IBM Assigned Patent for "Gap Capacitors for Monitoring Stress in Solder Balls in Flip Chip Technology"

Strategic Insights

— 1 min read

In a groundbreaking innovation, International Business Machines has been granted a patent (7,939,390) for "gap capacitors for monitoring stress in solder balls in flip chip technology." This advancements aims to improve the efficiency and reliability of semiconductor structures, particularly in flip chip technology. The patent, developed by five co-inventors, Stephen P. Ayotte, Timothy Harrison Daubenspeck, Jeffrey Peter Gambino, Christopher David Muzzy, and Wolfgang Sauter, addresses the issue of stress in solder balls, which can lead to device failure.

Key Takeaways:

  • The patent (7,939,390) was assigned to International Business Machines for "gap capacitors for monitoring stress in solder balls in flip chip technology."
  • The co-inventors, Stephen P. Ayotte, Timothy Harrison Daubenspeck, Jeffrey Peter Gambino, Christopher David Muzzy, and Wolfgang Sauter, developed a method and operation for semiconductor structure formation that includes a dielectric layer, bottom and top capacitor plates, a gap region, and a solder ball.
  • The gap region is crucial in this design, as it does not include any liquid or solid material and allows for the monitoring of stress in solder balls.
  • The patent application was filed on April 23, 2010, with the reference number 12/765,979.
  • This innovation aims to improve the efficiency and reliability of semiconductor structures, particularly in flip chip technology.

Statistics:

  • Patent number: 7,939,390
  • Date of patent assignment: May 15 (no publication date specified)
  • Number of co-inventors: 5
  • Number of semiconductor structure components: 5 (dielectric layer, bottom capacitor plate, top capacitor plate, gap region, solder ball)

Sources:

  • Go to http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,939,390&OS=7,939,390&RS=7,939,390
  • U.S. Patent and Trademark Office (USPTO)
  • IBM (International Business Machines)

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