IBM Receives Patent for Innovative Cooling Method Using Carbon Nanotubes and Magnetic Field

IBM Corporation has successfully developed an innovative cooling method utilizing carbon nanotubes and a magnetic field, as patented by the United States Patent and Trademark Office on July 14, 2015. The highly advanced cooling apparatus is designed to efficiently dissipate heat from semiconductor chips, promoting enhanced performance and reliability in electronic devices. The breakthrough technology involves the alignment of carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field, thereby revolutionizing the field of electronics cooling.

Key Takeaways:

• The patented cooling apparatus features a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors.
• The chip stack also includes a thermal interface material pad between the first chip and the second chip, which comprises a plurality of nanotubes containing a magnetic material, aligned parallel to mating surfaces.
• The alignment of carbon nanotubes using a magnetic field is achieved by wrapping a hydrophobic tail of oleic acid around each nanotube and attaching a hydrophilic acid head to the magnetic material.
• This innovative cooling method provides an effective means of dissipating heat from semiconductor chips, promoting enhanced device performance and reliability.
• The patent filing occurred on July 8, 2013, as Application no. 13/936,369, with the patent being granted on July 14, 2015, as no. 9,082,744.
• The inventors behind this breakthrough technology are Boday; Dylan J., Kuczynski; Joseph, and Meyer, III; Robert E., representing IBM Corporation.

Statistics:

• The patented cooling apparatus is designed to efficiently dissipate heat from semiconductor chips, with the capability to handle high heat loads.
• The application of carbon nanotubes and magnetic field technology allows for the preservation of thermal interface material and improved cooling performance.
• The number of citations for this patent is not mentioned in the provided text, but the patent has been granted as of July 14, 2015.
• The patent filing occurred on July 8, 2013, and the patent was granted on July 14, 2015, with the number 9,082,744.
• The variety of applications for this cooling apparatus includes but is not limited to, electronic devices and semiconductor chips.

Sources:

• United States Patent and Trademark Office
• International Business Machines Corporation
• U.S. Patent & Trademark Office abstract