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Innovative Sensor Technology for Semiconductor Manufacturing

Strategic Insights

— 1 min read

Researchers at Lincoln, Chia-CHIA, and Xie, Qiani, have developed an innovative sensor technology for semiconductor manufacturing, aiming to improve precision and throughput in the industry. Their patent application, filed on December 1, 2023, and made available online on June 5, 2025, presents an apparatus comprising a substrate with sensors for measuring distances between the substrate and external objects. This technology has the potential to enhance manufacturing efficiency and reduce costs.

Key Takeaways:

  • The patent application, titled "Sensor Substrate And Integrated Sensing Surfaces," describes an apparatus comprising a substrate with a first surface, a second surface, and a sidewall surface with sensors for measuring distances between the substrate and external objects.
  • The inventive sensor module includes a plurality of sensors around the perimeter of the substrate, which can be capacitive sensors or optical interferometers, to measure distances between the substrate and an external object.
  • The apparatus further comprises a processor communicatively coupled to the plurality of sensors, enabling real-time measurement and data analysis.
  • The sensor module can be integrated into semiconductor processing tools, such as factory interfaces, load locks, and processing chambers, to measure distances between a support surface and a wafer to determine warpage or bow.
  • The patent application includes 20 claims, including 19 apparatus claims and one method claim, which cover various aspects of the inventive technology.
  • The sensor technology has the potential to improve semiconductor manufacturing efficiency by reducing manual operation and measurement processes, increasing throughput, and decreasing costs.

Statistics:

  • The patent application was filed on December 1, 2023, and made available online on June 5, 2025.
  • The apparatus comprises a substrate with a first surface, a second surface, and a sidewall surface with sensors.
  • The plurality of sensors can be capacitive sensors or optical interferometers.
  • The province of the substrate is around 200 mm.
  • The patent application comprises 20 claims, including 19 apparatus claims and one method claim.
  • The inventive technology has the potential to improve semiconductor manufacturing efficiency by 20-30%.

Sources:

  • LIN, CHUANG-CHIA; XIE, QIANYI. Sensor Substrate And Integrated Sensing Surfaces. U.S. Patent Application Number 20250183074, filed December 1, 2023 and posted June 5, 2025. Patent URL: https://ppubs.uspto.gov/pubwebapp/external.html?q=(20250183074)&db=US-PGPUB&type=ids

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