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Integrated Decoupling Capacitor Patent Application Filed with US Patent and Trademark Office

Strategic Insights

— 1 min read

The United States Patent and Trademark Office has received an application for a patent titled "Integrated Decoupling Capacitor Employing Conductive Through-Substrate Vias" from International Business Machines Corporation. Filed on August 26, 2013, the patent application seeks to register a novel capacitor design that utilizes conductive through-substrate vias as an inner electrode and a columnar doped semiconductor region as an outer electrode. The proposed capacitor is expected to provide a large decoupling capacitance in a small area, without compromising circuit density or Si3D structural design.

Key Takeaways:

  • The patent application was filed on August 26, 2013, under application No. 20130344675.
  • The inventors of the proposed capacitor are Kim Tae Hong, McAllister Michael F., Shapiro Michael J., and Sprogis Edmund J., all of whom are employed by International Business Machines Corporation.
  • The capacitor employs conductive through-substrate vias as an inner electrode and a columnar doped semiconductor region as an outer electrode.
  • The proposed design is expected to provide a large decoupling capacitance in a small area, without impacting circuit density or Si3D structural design.
  • Additional conductive TSV's can be provided in the semiconductor substrate to enable electrical connection for power supplies and signal transmission.
  • The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips.
  • The patent application was published on December 26, 2013.

Statistics:

  • Application No.: 20130344675
  • Filing Date: August 26, 2013
  • Publication Date: December 26, 2013
  • Expected benefits: large decoupling capacitance in a small area, without compromising circuit density or Si3D structural design

Sources:

  • United States Patent and Trademark Office
  • http://www.uspto.gov/

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