Intel Receives Patent for Split Thin Film Capacitor

A newly patented technology by Intel enables multiple power supply voltage levels for electrical devices like integrated circuits, addressing space restrictions and high clock rate demands. This innovation, developed by Cengiz A. Palanduz and Larry E. Mosley, provides a compact solution for devices requiring close electrical connections between power consumers and suppliers. The patent application was filed on July 27, 2009, and the patent is assigned number 7,986,532.

Key Takeaways:

• The patented technology features a split thin film capacitor that provides multiple power and reference supply voltage levels to electrical devices.
• The capacitor is useful in space-restricted applications and those requiring close electrical connections between power consumers and suppliers.
• The technology addresses the need for close coupling in high clock rate microprocessors, which require a compact capacitor with multiple power supply levels.
• The capacitor can supply power to different portions of the microprocessor, including the fast core logic and cache memory.
• The patent application was filed by Cengiz A. Palanduz and Larry E. Mosley on July 27, 2009.
• The patent number assigned to the technology is 7,986,532.

Statistics:

• The patent application (12/509,666) was filed on July 27, 2009.
• The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,986,532&OS=7,986,532&RS=7,986,532.

Sources:

• Patent abstract written by the U.S. Patent and Trademark Office
• Patent file number 12/509,666
• Patent full-text available at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,986,532&OS=7,986,532&RS=7,986,532