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Intel Unveils Comprehensive Process and Packaging Technology Roadmap to 2025 and Beyond

Strategic Insights

— 2 min read

Intel Corporation revealed a detailed process and packaging technology roadmap that showcases a series of foundational innovations to power products through 2025 and beyond. The company introduced a new naming structure for its manufacturing process nodes and announced RibbonFET, its first new transistor architecture in over a decade, and PowerVia, an industry-first new backside power delivery method. Intel also highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV, and confirmed more details on its Intel InnovatiON event.

Key Takeaways:

  • Intel introduced a new naming structure for its process nodes, which includes the name changes from 10nm SuperFin to Intel 7, and from Intel 4 to Intel 7nm.
  • The company unveiled RibbonFET, its first new transistor architecture in over a decade, and PowerVia, an industry-first new backside power delivery method.
  • Intel announced its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV.
  • The company highlighted its industry-leading advanced packaging roadmap, including the recently announced first customer to use IFS packaging solutions, AWS.
  • Intel is positioned to receive the first High NA EUV production tool in the industry.
  • The company's IDM 2.0 strategy focuses on packaging as a key factor in realizing the benefits of Moore's Law.
  • Intel's breakthroughs were primarily developed at its facilities in Oregon and Arizona, and the company is committed to partnering with governments to strengthen supply chains and drive economic and national security.

Statistics:

  • Intel has a long history of foundational process innovations, including the transition to strained silicon at 90nm, to high-k metal gates at 45nm, and to FinFET at 22nm.
  • Intel 20A will be a watershed moment in process technology, with two groundbreaking innovations: RibbonFET and PowerVia.
  • Intel is accelerating its innovation roadmap to ensure a clear path to process performance leadership by 2025.
  • The company has a robust pipeline of innovation, and its technologists described the following roadmap with the new node names and the innovations enabling each node.

Sources:

  • Intel Corporation. (2021, July 26). Intel Unveils Process and Packaging Technology Roadmap to 2025 and Beyond. Retrieved from https://www.intel.com/content/www/us/en/newsroom/news-releases/2021/intel-unveils-process-and-packaging-technology-roadmap.html
  • Intel Corporation. (2021, July 26). Press Release: Intel Unveils Process and Packaging Technology Roadmap to 2025 and Beyond. Retrieved from https://newsroom.intel.com/news-releases/intel-unveils-process-and-packaging-technology-roadmap-to-2025-and-beyond/
  • Intel Corporation. (2021, July 26). Intel 20A: A Watershed Moment in Process Technology. Retrieved from https://www.intel.com/content/www/us/en/newsroom/news-releases/2021/intel-20a.html
  • Intel Corporation. (2021, July 26). RibbonFET: Intel's First New Transistor Architecture in Over a Decade. Retrieved from https://www.intel.com/content/www/us/en/newsroom/news-releases/2021/ribbonfet.html
  • Intel Corporation. (2021, July 26). PowerVia: An Industry-First New Backside Power Delivery Method. Retrieved from https://www.intel.com/content/www/us/en/newsroom/news-releases/2021/powervia.html

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