Mitel Semiconductor Announces DS313, a High-Performance Distributed Switch for Local Area Networks

Mitel Semiconductor has announced the DS313, a single chip distributed switch that supports Layer 2, 3, and 4 packet forwarding and filtering in Local Area Networks (LANs). This device, designed by Vertex Networks, Inc., operates at full wire-speed and includes advanced features such as enhanced Quality of Service (QoS), Layer 3 routing, and protocol filtering. The DS313 is the latest member of the XF2080 family, supporting advanced network management software and QoS standards for packet prioritization.

The DS313 is highly integrated, reducing the overall system chip count and glue logic. Its robust QoS capability, low latency, and high frame-forwarding rate make it an ideal choice for time-critical data. The device is also designed to support up to 22K IP subnets per chip or 64K MAC addresses per chip and per system. According to IDC, LAN switching represents a high-growth opportunity in the enterprise marketplace, with Layer 3 switches expected to account for most of the revenue in this segment from 1999 to 2003.

Key Takeaways:

  • The DS313 is a single chip distributed switch that supports Layer 2, 3, and 4 packet forwarding and filtering in Local Area Networks.
  • The device includes advanced features such as enhanced Quality of Service (QoS), Layer 3 routing, and protocol filtering.
  • The DS313 operates at full wire-speed and has a robust QoS capability, low latency, and high frame-forwarding rate.
  • The device is highly integrated, reducing the overall system chip count and glue logic.
  • The DS313 supports up to 22K IP subnets per chip or 64K MAC addresses per chip and per system.
  • Layer 3 switches are expected to account for most of the revenue in the LAN switching segment from 1999 to 2003, according to IDC.
  • IDC forecasts that Layer 3 shipments will increase from nearly 5 million ports and $3 billion in revenue in 1999 to more than 59 million ports and $11.4 billion in revenue in 2003.
  • The DS313 provides a complete solution for adding IP routing switches to wiring closet stacks using VerSA software.
  • Up to 8 DS313 chips can be connected through the Xpipe interface to form a non-blocking Layer 3 switch.

Statistics:

  • Layers 3 switches are expected to account for most of the revenue in the LAN switching segment from 1999 to 2003 (IDC).
  • Layer 3 shipments will increase from nearly 5 million ports and $3 billion in revenue in 1999 to more than 59 million ports and $11.4 billion in revenue in 2003 (IDC).
  • The DS313 can support up to 22K IP subnets per chip or 64K MAC addresses per chip and per system.

Sources:

  • "Worldwide LAN Switch Market Review and Forecast, 1997-2003," by Esmarelda Silva, Nov 99, IDC# 20502
  • Mitel Semiconductor press release, Sept. 25, 2000