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Semiconductor industry

Philips Semiconductors and SPEA Software AG Establish Joint Venture for 3D Chip Design

Strategic Insights

— 1 min read

Philips Semiconductors and SPEA Software AG have announced the formation of a joint venture, SP3D Chip Design GmbH, to develop 3D-capable, high-performance multimedia ICs for applications such as PCs and game consoles. The new company will focus on integrating Philips' video expertise with SPEA's leading-edge 3D expertise, with the goal of creating multimedia ICs that can rival high-end 32-bit game machines.

Key Takeaways:

  • The joint venture, SP3D Chip Design GmbH, will be 50.5% owned by Philips Semiconductors and will focus on developing 3D-capable, high-performance multimedia ICs.
  • The new company will leverage Philips' video expertise and SPEA's 3D expertise to create ICs that can integrate video encoding with 3D acceleration.
  • The joint venture's first product, a 3D acceleration IC, will be produced using Philips' 0.5 micron CMOS process technology before switching to 0.35 micron CMOS technology.
  • First samples of the IC will be available at the beginning of 1996.
  • All products developed by SP3D Chips Design will be marketed under the brand name of Philips Semiconductors.
  • SPEA Software AG, the other partner in the joint venture, is a leading manufacturer of high-end 3D and multimedia PC boards and has a workforce of 150 employees.
  • Philips Semiconductors, the other partner in the joint venture, is the eleventh largest semiconductor supplier in the world and has a strong presence in the consumer, multimedia, and wireless communications market.

Statistics:

  • The joint venture, SP3D Chip Design GmbH, will be 50.5% owned by Philips Semiconductors.
  • The new company will include a team of experienced graphic engineers who had previously worked at SPEA's independent division.
  • SPEA Software AG has a workforce of 150 employees.
  • Philips Semiconductors is the eleventh largest semiconductor supplier in the world.
  • First samples of the joint venture's first product, a 3D acceleration IC, will be available at the beginning of 1996.

Sources:

  • [BUSINESS WIRE, "Philips Semiconductors and SPEA Software AG Announce Joint Venture," September 27, 1995.]

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