Powerchip Semiconductor Manufacturing Corporation Receives Patent for Innovative Image Sensor Structure
Powerchip Semiconductor Manufacturing Corporation, a leading manufacturer of semiconductors in Taiwan, has been awarded a patent for an innovative image sensor structure that offers improved image quality and reduced fixed pattern noise. This breakthrough technology is likely to have significant implications for the electronic devices industry, particularly in the production of high-quality cameras and image sensors.
The patented image sensor structure features a deep trench isolation (DTI) design that separates adjacent pixels, reducing optical and electrical crosstalk between them. This innovative design allows for improved image quality, reduced fixed pattern noise, and enhanced overall performance of the image sensor. The structure is particularly suited for backside illuminated (BSI) image sensors, which are commonly used in modern electronic devices such as smartphones and digital cameras.
Key Takeaways:
- The patented image sensor structure features a DTI design that reduces optical and electrical crosstalk between adjacent pixels, improving image quality and reducing fixed pattern noise.
- The structure is particularly suited for BSI image sensors, commonly used in modern electronic devices.
- The patented technology offers improved performance and enhanced image quality, making it a significant innovation in the electronic devices industry.
- Powerchip Semiconductor Manufacturing Corporation has been awarded the patent for this technology, reflecting its commitment to innovation and research and development.
- The patent is titled "Image Sensor Structure" and was filed on October 26, 2022, with publication on September 30, 2025.
Statistics:
- Patent number: 12433052
- Filing date: October 26, 2022
- Publication date: September 30, 2025
- 10 claims were filed as part of the patent application
- The patent features a unique DTI design that separates adjacent pixels, improving image quality and reducing fixed pattern noise
Sources:
- Chung, Chih-Ping. Image Sensor Structure. U.S. Patent Number 12433052, filed October 26, 2022, and published online on September 30, 2025.
- Powerchip Semiconductor Manufacturing Corporation.