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Alloys

Researchers Explore Alternative Materials for Next-Generation Semiconductor Interconnects

Strategic Insights

— 1 min read

Researchers at SRM Institute of Science and Technology have been investigating alternative materials for use in interconnects in integrated circuits. According to the study, copper, the standard material used for decades, has limitations, including high resistivity and electromigration. The study focused on silver and silver-copper alloys as potential substitutes, highlighting their benefits, such as lower resistivity, higher thermal conductivity, and improved current transmission capabilities.

Key Takeaways:

  • The study identified copper as the primary material used in interconnects due to its low resistivity, high electrical conductivity, and cost-effectiveness.
  • However, as technology scales down, copper's limitations, including increased resistivity and electromigration, become significant concerns.
  • Silver and silver-copper alloys have been explored as potential alternatives due to their improved electrical, thermal, and physical characteristics.
  • Silver has a lower resistivity (1.59 O·cm) and higher thermal conductivity (429 W/m·K) compared to copper, making it an ideal material for high-performance interconnects.
  • Silver-copper alloys offer a balance between the high electrical conductivity of silver and the affordability and robustness of copper.
  • The study reviewed the materials' diffusion behavior, resistance to electromigration, and integration issues, as well as their electrical, thermal, and physical characteristics.

Statistics:

  • Copper has a resistivity of ~1.68 O·cm, while silver's resistivity is ~1.59 O·cm.
  • Silver has a thermal conductivity of 429 W/m·K, while copper has a thermal conductivity of 385 W/m·K.
  • Silver-copper alloys have shown potential benefits for deep-submicron IC technology, offering a reliable balance between electrical conductivity and affordability.

Sources:

  • EPJ Web of Conferences, 2025, 336():01006, " Investigation of Ag-Cu Alloys for Interconnects in IC"

(http://www.epj-conferences.org/)

  • EPJ Web of Conferences, publisher EDP Sciences, 2025, https://doi-org.sdpl.idm.oclc.org/10.1051/epjconf/202533601006

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