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Electronic components

Samsung Electronics Co. Ltd. Files Patent for High-Integration Printed Circuit Board and Semiconductor Package with Improved Reliability

Strategic Insights

— 1 min read

Samsung Electronics Co. Ltd., a leading electronics company based in South Korea, has recently filed a patent for a high-integration printed circuit board and semiconductor package with improved reliability features. The patent, filed by inventor Kim, Hyejin, was published online on September 30, 2025. According to the patent, the proposed printed circuit board and semiconductor package features a multi-layered photosensitive insulating layer, which provides improved reliability and precision patterning capabilities.

Key Takeaways:

  • The proposed printed circuit board and semiconductor package feature a multi-layered photosensitive insulating layer, which provides improved reliability and precision patterning capabilities.
  • The multi-layered photosensitive insulating layer consists of a first sub-layer, a second sub-layer, a third sub-layer, and a fourth sub-layer, which are stacked sequentially.
  • The first sub-layer includes an amine compound or an amide compound, while the second and third sub-layers have a refractive index that is lower than the refractive index of the fourth sub-layer.
  • The second and third sub-layers have a photosensitizer content that is higher than the photosensitizer content of the fourth sub-layer.
  • The printed circuit board and semiconductor package also include conductive patterns and redistribution substrates, which provide improved electrical signal and power transmission capabilities.
  • The proposed design is intended to improve the reliability and performance of electronic devices, such as smartphones and laptops.

Statistics:

  • The patent application was filed on May 5, 2022, and published online on September 30, 2025.
  • The proposed printed circuit board and semiconductor package feature a multi-layered photosensitive insulating layer, which consists of a first sub-layer, a second sub-layer, a third sub-layer, and a fourth sub-layer.
  • 20 A to 2000 A is the proposed thickness range for the first sub-layer.
  • 15 claims are included in the patent application.

Sources:

  • Kim, Hyejin. Printed circuit board and semiconductor package which include multi-layered photosensitive insulating layer. U.S. Patent Number 12431463, filed May 5, 2022, and published online on September 30, 2025.
  • Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12431463)&db=USPAT&type=ids

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