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Artificial intelligence

Smartkem and Manz Asia Collaborate on Advanced Inkjet Metallization for SEMICON SEA 2025

Strategic Insights

— 1 min read

Smartkem, a leading developer of advanced semiconductor materials, has entered into a collaboration with Manz Asia to demonstrate its advanced inkjet metallization technology using Smartkem's dielectric materials at SEMICON SEA 2025 in Singapore. The collaboration aims to address the growing demand for advanced computer and AI chip packaging solutions. Smartkem's Chairman and CEO, Ian Jenks, stated that the company is thrilled to be working with Manz Asia to enable large area panel chip packaging beyond existing constraints. Manz Asia's General Manager, Robert Lin, emphasized the significance of the collaboration, highlighting the potential of their inkjet platform combined with next-generation dielectric materials to deliver scalable and sustainable solutions.

Key Takeaways:

  • Smartkem and Manz Asia are collaborating to demonstrate advanced inkjet metallization technology using Smartkem's dielectric materials at SEMICON SEA 2025 in Singapore.
  • The collaboration aims to address the growing demand for advanced computer and AI chip packaging solutions.
  • Smartkem's Chairman and CEO, Ian Jenks, stated that the company is thrilled to be working with Manz Asia to enable large area panel chip packaging beyond existing constraints.
  • Manz Asia's inkjet platform is suitable for various substrates, including PI, ABF, EMC, silicon, and glass, in both wafer and panel formats.
  • The collaboration has designed ink formulations suitable for use in advanced computer and AI chip packaging applications, compatible with Manz Asia's existing inkjet-based semiconductor production equipment.
  • Panel level packaging offers key advantages over traditional packaging on circular wafers, including higher throughput, lower cost per chip, better material utilization, and improved integration.
  • Smartkem is seeking to change the world of electronics with a new class of transistors developed using its proprietary advanced semiconductor materials.
  • Smartkem has an extensive IP portfolio, including 138 granted patents across 17 patent families, 16 pending patents, and 40 codified trade secrets.

Statistics:

  • The market for panel level packaging is expected to grow to approximately $600 million in 2030, with a 27% compound annual growth rate from 2024.
  • Smartkem has designed ink formulations suitable for use in advanced computer and AI chip packaging applications.
  • Manz Asia's inkjet platform is capable of accurate material deposition and supports a wide range of inks.

Sources:

  • [1] Manz Asia: https://www.manz-group.com/about-manaz/asia
  • [2] Smartkem: https://www.smartkem.com/about-us/our-story
  • [3] Yole Intelligence: Panel Level Packaging 2025

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