Patents
A patent for a digital signal processor, and a digital image processing apparatus adopting the same, has been granted to Samsung Electronics Co., Ltd. The invention, described by inventor Lee, Myung-hun, allows for a digital image processing apparatus to perform a live-view operation with increased speed and efficiency. This is
Patents
A patent application filed on January 22, 2015, with Omron Corporation, has shed light on a novel image processing device and method capable of shortening the time required for setting parameters in an image processing system. The inventors, MINATO, Yoshihisa and AKATSUKA, Yuhki, have developed a device that can automatically
Patents
Research and development in hermetic packaging of integrated circuit components has led to significant breakthroughs in the field of radio frequency (RF) and microelectromechanical systems (MEMS) devices. Engineers at Raytheon Company have invented a method for forming hermetic packages using silicon wafers, which can be transformed to create conductive regions
Patents
Researchers at Samsung Electronics Co., Ltd. have developed a method for transmitting data without the need for a separate transceiver, utilizing a display device and a camera. This innovative approach allows for synchronization of transmitted data between the sending and receiving ends, enabling efficient and reliable data transfer. Key Takeaways:
Patents
According to patent literature 1, existing storage systems can arrange microprocessors and local memories within a storage subsystem. However, these systems often require a microprocessor to access address mapping information, which can degrade performance. The present invention addresses this issue by storing address mapping information in a storage device and
Patents
Developers at Samsung Electronics Co., Ltd. have invented a non-volatile memory device that uses a mapping manager to improve data read operations. The invention relates to memory devices, particularly non-volatile memory devices, and aims to prevent erase operations from focusing on a specific block of a flash memory device. The
Patents
A recent patent by NEC Corporation has proposed a groundbreaking solution to detect and prevent cyber attacks in mobile communication systems. The invention, filed by Yuichi Kusumoto on November 1, 2011, and published on August 25, 2015, aims to address the vulnerability of mobile terminals to cyber attacks by introducing
Patents
Scientists at Semiconductor Manufacturing International Corporation have invented a revolutionary new device that can detect subtle changes in pressure, opening up vast possibilities for applications in fields like medicine, transportation, and industrial automation. The device, a micro-electromechanical systems (MEMS) capacitive pressure sensor, uses a novel structure that enables it to
Patents
A patent application filed on May 21, 2013, by inventors Kou Ito, Kouji Teramoto, and Hiroyasu Momikura, proposes a flow path member that enhances the cooling efficiency of workpieces in semiconductor manufacturing apparatuses. The inventors, employed by KYOCERA Corporation, aim to address the issue of decreased processing accuracy due to
Patents
Patent number 9026828, filed on December 31, 2012, and published online on May 5, 2015, proposes innovative systems and methods for reducing power consumption at system-on-chip. The invention, attributed to inventor Park, Jinkwon, focuses on optimizing power management in low-power systems, addressing the increasing need for energy conservation in home
Patents
A new patent application by EUM, Ju-ho, filed on October 1, 2014, has been made available online, outlining a method for executing web applications in image forming apparatuses. The application, assigned to Samsung Electronics Co., Ltd., aims to provide a solution for executing web applications in devices with limited display
Patents
In a breakthrough development, Teledyne Rad-icon Imaging Corp. has been issued a patent for a novel method of direct tiling of an image sensor array, overcoming the limitations of existing assembly methodologies. This innovation is set to revolutionize the manufacturing process for large tiled sensor panel assemblies, enabling cost-effective and
