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Network hardware industry

Tensilica Secures $20 Million in Third Round of Funding

Strategic Insights

— 1 min read

Tensilica Inc., a leading provider of application-specific processor technology, has announced the successful completion of its third round of funding, securing a total of $20 million from a diverse group of high-tech companies and venture capital firms. This funding brings the company's total capitalization since its founding in 1997 to $33 million. The investment round was led by Foundation Capital, a repeat investor, with participation from several notable companies, including Cisco Systems, Altera Corporation, and Matsushita Electric Industrial Company Ltd.

Key Takeaways:

  • Tensilica has secured $20 million in its third round of funding, raising its total capitalization to $33 million since its founding in 1997.
  • The investment round was led by Foundation Capital, with participation from high-tech companies like Cisco Systems, Altera Corporation, and Matsushita Electric Industrial Company Ltd.
  • Chris Rowen, Tensilica's president and CEO, expressed enthusiasm about the investments from world-class companies and the renewed confidence shown by repeat investors.
  • Tensilica's solutions provide a proven methodology for SOC designers to achieve optimal application performance in minimal design time using the company's proprietary Xtensa Processor Generator.
  • Over 50 engineers are engaged in research, development, and customer support from Tensilica's offices in Santa Clara, California, Waltham, Massachusetts, and Yokohama, Japan.
  • The company is headquartered in Santa Clara, California, and can be reached at (408) 986-8000 or via the World Wide Web at http://www.tensilica.com.

Statistics:

  • Total funding secured by Tensilica in its third round: $20 million
  • Total capitalization of Tensilica since its founding in 1997: $33 million
  • Number of engineers engaged in research and development at Tensilica: over 50
  • Locations with Tensilica offices: Santa Clara, California, Waltham, Massachusetts, and Yokohama, Japan

Sources:

  • BUSINESS WIRE, July 26, 1999, Tensilica Inc. Closes $20 Million Third Round of Funding

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