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Machine learning

Wafer Conveyance Unit and Method for Semiconductor Failure Analysis Apparatus

Strategic Insights

— 1 min read

Researchers at Hamamatsu Photonics K.K. have developed a wafer conveyance unit and method for semiconductor failure analysis apparatus, designed to hold wafers firmly during conveyance without hindering each function of the apparatus. The wafer conveyance unit includes a fixing unit, a conveyance unit, and a ring portion that partitions a housing space for housing the wafer. The conveyance unit holds the wafer by sandwiching a peripheral portion of the wafer with a plurality of holding members. The method involves providing a conveyance unit, sandwiching the wafer with the holding members, and conveying the wafer to a predetermined observation position.

Key Takeaways:

  • The wafer conveyance unit consists of a fixing unit, a conveyance unit, and a ring portion that partitions a housing space for housing the wafer.
  • The conveyance unit includes a plurality of holding members that protrude toward the housing space, comprising a first holding member with one or more protruding portions and a second holding member spaced from the first holding member.
  • The wafer conveyance method involves sandwiching the wafer with the holding members and conveying the wafer to a predetermined observation position.
  • The unit is designed to hold wafers firmly during conveyance without hindering each function of the semiconductor failure analysis apparatus.
  • The wafer conveyance unit and method can be used in a semiconductor failure analysis apparatus to hold wafers firmly during conveyance.
  • The researchers at Hamamatsu Photonics K.K. have filed a patent, U.S. Patent Number 12347718, for the wafer conveyance unit and method.
  • The patent was filed on November 9, 2020, and published online on July 1, 2025.
  • The keywords for this news article include: Physics, Business, Robotics, Electronics, Semiconductor, Machine Learning, Emerging Technologies, and Hamamatsu Photonics K.K.

Statistics:

  • The wafer conveyance unit has a ring portion that partitions a housing space for housing the wafer.
  • The conveyance unit includes a plurality of holding members that protrude toward the housing space, specifically 3 or more protruding portions in claim 2, and 4 or more in claim 3.
  • The wafer conveyance method involves conveying the wafer to a predetermined observation position.

Sources:

  • Ikesu, Masataka. Wafer conveyance unit and wafer conveyance method. U.S. Patent Number 12347718, filed November 9, 2020, and published online on July 1, 2025.
  • Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(12347718)&db=USPAT&type=ids

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