Sign in Subscribe
Electronics industry

Patent Application for Cellular Wafer Structure Reveals Insights into Lateral Semiconductor Device Units

Strategic Insights

— 1 min read

Researchers have filed a patent application for a cellular wafer structure that utilizes lateral semiconductor device units, providing a new approach to semiconductor fabrication. The application, filed by Adam Benjamin Barkley and Craig William Hardin, proposes a method for arranging a semiconductor wafer with a plurality of lateral semiconductor device units, each having a predetermined unit size. The inventors aim to improve the efficiency and yield of semiconductor devices by optimizing the arrangement of these units.

Key Takeaways:

  • The patent application proposes a method for arranging a semiconductor wafer with a plurality of lateral semiconductor device units, each having a predetermined unit size.
  • The method involves determining the unit size for each lateral semiconductor device unit based on post-fabrication plan data associated with reference semiconductor wafers.
  • The inventors aim to improve the efficiency and yield of semiconductor devices by optimizing the arrangement of lateral semiconductor device units.
  • The proposed method can be used to determine the optimal dimensions for a plurality of semiconductor die, each comprising at least one lateral semiconductor device unit.
  • The patent application includes 20 claims, including methods for determining unit size, arranging semiconductor wafers, and cutting semiconductor wafers into semiconductor die.
  • The invented cellular wafer structure has the potential to improve the performance and yield of semiconductor devices.

Statistics:

  • The patent application was filed on March 26, 2024.
  • The patent application was posted on October 2, 2025.
  • The inventors, Adam Benjamin Barkley and Craig William Hardin, have filed a U.S. patent application with the patent number 20250311382.

Sources:

  • Barkley, Adam Benjamin; Hardin, Craig William. Cellular Wafer Structure. U.S. Patent Application Number 20250311382, filed March 26, 2024 and posted October 2, 2025. Patent URL (for desktop use only): https://ppubs.uspto.gov/pubwebapp/external.html?q=(20250311382)&db=US-PGPUB&type=ids Keywords for this news article include: Electronics, Semiconductor, Patent Application. Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2025, NewsRx LLC.

Read more