Electronics industry
Researchers at the Chinese Academy of Sciences have made significant strides in understanding the properties and applications of organic semiconductors, a class of materials that have been under investigation for over 40 years. The study aims to explain the peculiarities of room temperature organic photodetectors and how they differ from
Electronics industry
Scientists at Young Hun Han, Hyun Chul Lim, and June O. SONG have filed a patent application (US20250311346) that presents a revolutionary solution for improving GaN HEMT technology, which is crucial for the development of high-power electronic devices. The proposed innovation focuses on creating an epitaxial wafer with enhanced electrical
Electronics industry
A new patent filed by inventor Lim, Mingyu, on November 22, 2021, has been published online, detailing a mask-programmable read only memory (ROM) with electrically isolated cells. The patent, number 12432912, was published on September 30, 2025, and is assigned to SK keyfoundry Inc. This innovative design addresses the limitations
Electronics industry
NASA's plan to deploy a fully functional 3D printer in low Earth orbit aims to revolutionize in-space manufacturing of semiconductor electronics. Researchers from Oregon State University have successfully demonstrated the use of electrohydrodynamic printing for semiconductor manufacturing and are now exploring laser sintering as a viable technology for
Electronics industry
Researchers at a US-based company have made significant advancements in semiconductor technology, inventing a new type of stacked field effect transistor (FET) that surpasses existing devices in efficiency and compactness. According to the patent application, the innovative design combines two FETs stacked on top of each other, with a multilayered
Electronics industry
Effective thermal management is crucial for high-power devices to prevent overheating, which can degrade their performance and reliability. However, existing studies often oversimplify the heat source as a constant power region, neglecting the effects of periodic thermal cycling. Researchers from the University of Nottingham, in collaboration with the Ningbo Science
Electronics industry
Researchers YAO, Jiaxin, YIN, Huaxiang, and ZHANG, Xuexiang have submitted a patent application for a hybrid integrated SRAM memory cell structure and a method of manufacturing a hybrid integrated SRAM memory cell structure. The invention aims to improve the performance of SRAM by combining gate-all-around field effect transistors (GAAFETs) and
Electronics industry
In a recent breakthrough, a team of inventors has created an innovative interactive theater system designed to revolutionize the video game experience. The system, patented under number 12427408, allows multiple players to engage in immersive video games while providing interactive feedback and dynamic special effects. According to the inventors, this
Electronics industry
Citizens around the world are playing a key role in advancing the field of science, particularly in the area of protein structure modeling. A new study has demonstrated the effectiveness of the citizen science video game Foldit in improving the accuracy of protein models in the Protein Data Bank (PDB)
Electronics industry
Researchers at East Carolina University have conducted a systematic review and content analysis of serious video games designed for children and adolescents with Attention Deficit Hyperactivity Disorder (ADHD). The study, published in Frontiers in Psychiatry, aimed to understand the effects of these games on ADHD symptoms. However, the findings suggest
Electronics industry
Researchers have filed a patent application for a cellular wafer structure that utilizes lateral semiconductor device units, providing a new approach to semiconductor fabrication. The application, filed by Adam Benjamin Barkley and Craig William Hardin, proposes a method for arranging a semiconductor wafer with a plurality of lateral semiconductor device
Electronics industry
Researchers Lohse, Murugan, Sakai, and Suzuki have filed a patent application for a novel technique to reduce dielectric layer cracking in microelectronic devices. The methodology involves increasing the overlap of the protective dielectric layer over the bond pads to reduce dielectric stress and eliminate cracking. According to the inventors, stress
