Patents
A team of inventors led by Afzali-Ardakani, Ali, has developed a groundbreaking method for determining the isoelectric points of biomolecules using capacitive sensors. This innovative approach is poised to revolutionize the field of biomolecule analysis, offering a faster, more accurate, and cost-effective alternative to traditional methods. According to the inventors,
Patents
IBM has patented a breakthrough technology in semiconductor electronics, revolutionizing the field of carbon nanotube field-effect transistors. The inventors, Aaron D. Franklin, Joshua T. Smith, and George S. Tulevski, have developed a novel approach to enhancing the performance of carbon nanotube thin films in thin-film transistors (TFTs). The patent, number
Patents
Computing environments are increasingly reliant on data storage systems that require upgrades to maintain security, compatibility, and redundancy. A patent application has been filed by International Business Machines Corporation for a system and method for implementing intelligent rolling upgrades in data storage systems. The solution aims to reduce costs, improve
Patents
Researchers from International Business Machines Corporation (IBM) have developed a method to fabricate semiconductor structures using graphene nanoribbons and carbon nanotubes. These structures have the potential to improve the performance and miniaturization of electronic devices, according to a patent filed on October 28, 2013, and published on July 28, 2015.
Patents
IBM, a technology giant, has patented a revolutionary thin film hybrid junction field effect transistor (JFET) designed for large-area electronics such as displays and active-matrix displays. The innovative technology overcomes the limitations of traditional large-area deposition techniques, which often result in non-crystalline or poly-crystalline materials with inferior performance. The new
Patents
On August 4, 2015, the United States Patent and Trademark Office granted patent no. 9,099,164 to International Business Machines Corporation (IBM) of New York, titled "Capacitor backup for SRAM." The innovative technology, developed by a team of IBM inventors, including Karl R. Erickson, Phil C. Paone,
Patents
A team of researchers from International Business Machines Corporation (IBM) has developed a patent for a secure cloud implementation system. The patent, titled "Securing Sensitive Information in a Network Cloud," was published online on July 21, 2015. The system is designed to secure sensitive information in a network
Patents
A U.S. appeals court has upheld a $14.5-million verdict against Google, ruling that the company unfairly demanded billions of dollars for the use of patents covering Wi-Fi and video downloads on smartphones and computers. The decision, which may lower the rates electronics makers pay to license technology considered
Patents
Apple Inc. has been awarded a groundbreaking patent by the United States Patent and Trademark Office for its innovative antenna and proximity sensor design, which enables seamless connectivity and gesture recognition on electronic devices. The patent, titled "Antenna and Proximity Sensor Structures Having Printed Circuit and Dielectric Carrier Layers,
Patents
The United States Patent and Trademark Office has granted patent no. 9,086,551 to INTERNATIONAL BUSINESS MACHINES CORPORATION (New York), titled "Double mirror structure for wavelength division multiplexing with polymer waveguides." The patent was awarded on July 21, 2015, to inventors Jean Benoit Heroux of Tokyo, Japan.
Patents
United States Patent and Trademark Office has received an application for a US Patent with the title "CONFORMAL COATING COMPOSITION CONTAINING METAL NANOPARTICLES TO PREVENT SULFUR RELATED CORROSION". The patent application, published on July 16, 2015, was filed by International Business Machines Corporation. The inventors, Dylan J. Boday,
Patents
IBM Corporation has successfully developed an innovative cooling method utilizing carbon nanotubes and a magnetic field, as patented by the United States Patent and Trademark Office on July 14, 2015. The highly advanced cooling apparatus is designed to efficiently dissipate heat from semiconductor chips, promoting enhanced performance and reliability in
